Here’s the page we think you wanted. See search results instead:

 

Skip to end of metadata
Go to start of metadata

EM Application Examples by Platform

Sort by ...

Antenna, Package, Connector, Board,...
FEM, FDTD, MOM
Platform
Platform
ADS, RFPro, EMPro

Select and Application Example

Select an Keysight EEsof EDA platform from the tabs below to display a list of EM application examples related to that product family.

    Application Example Screenshot Summary
    LTCC RF Module An RF balun implemented in low temperature co-fired ceramic (LTCC) technology is simulated with 3D FEM technology in ADS.
    SIW Filter A Substrate Integrated Waveguide (SIW) bandpass filter is analyzed with the FEM simulator in ADS and EMPro.
    RF Filter with Shield The impact of a 3D shield on RF filter performance is characterized using FEM simulation in ADS.
    Solder Bumps Solder bumps are simulated with 3D FEM in ADS utilizing the 3D EM Component capability.
    VCO with Dielectric Resonator A 3D geometry model for a dielectric resonator is created in EMPro and then placed in a board layout and simulated with 3D FEM technology in ADS.
    Multi-band Planar Array Antenna A multi-band (C- and X-band) planar array antenna is simultated with Momentum.
    QFN Package In this example, a 3mm x 3mm 16-pin Quad Flat No-Lead (QFN) package is optimized to improve the frequency performance using the FEM Simulator.
    RF Module Fan-Out Wafer Level (FOWL) Packaging RF Module assembly and interconnect routing of multi-technology silicon RF transceiver and GaAs filter on a Fan-Out Wafer Level Package (FOWLP). Automatic RF net extraction with RFPro enables critical signal paths through 3D interconnects to be efficiently analyzed with EM-circuit cosimulation without layout modification.
    BGA Package A 45 mm package with high speed traces is simulated with Momentum and compared against measured data.
    MMIC Power Amplifier The design of an MMIC Power Amplifier needs to consider the effects of inductor electromagnetic coupling on chip and the MMIC packaging off chip. RFPro makes it easy to perform EM-circuit co-simulation of the MMIC by automatically launching and combining the EM and circuit simulation  results to reveal the frequency shifts, gain and match degradation caused by EM couplings and MMIC packaging.

    Application Example Screenshot Summary
    RF Module Fan-Out Wafer Level (FOWL) Packaging RF Module assembly and interconnect routing of multi-technology silicon RF transceiver and GaAs filter on a Fan-Out Wafer Level Package (FOWLP). Automatic RF net extraction with RFPro enables critical signal paths through 3D interconnects to be efficiently analyzed with EM-circuit cosimulation without layout modification.
    MMIC Power Amplifier The design of an MMIC Power Amplifier needs to consider the effects of inductor electromagnetic coupling on chip and the MMIC packaging off chip. RFPro makes it easy to perform EM-circuit co-simulation of the MMIC by automatically launching and combining the EM and circuit simulation  results to reveal the frequency shifts, gain and match degradation caused by EM couplings and MMIC packaging.

    Application Example Screenshot Summary
    SIW Filter A Substrate Integrated Waveguide (SIW) bandpass filter is analyzed with the FEM simulator in ADS and EMPro.
    RF Filter with Shield The impact of a 3D shield on RF filter performance is characterized using FEM simulation in ADS.
    RCS and Scattering Simulation Radar Cross Section (RCS) and Scattering Simulation for F15 Fighter Jet with a plane wave excitation.
    Parameterized Design - DDRW A double ridge rectangular waveguide is parameterized in EMPro.
    SATA Connector 3D simulations of a SATA connector is done using FDTD in EMPro, and then utilized in a signal integrity simulation in ADS.
    Defected Ground Structure DGS Two microstrip designs based on spiral defected ground structures (DGS) are simulated using FEM and FDTD technologies in EMPro, and results are compared to measurement data.
    VCO with Dielectric Resonator A 3D geometry model for a dielectric resonator is created in EMPro and then placed in a board layout and simulated with 3D FEM technology in ADS.
    SIW Cavity-Backed Antenna FEM simulation is used to analyze a SIW cavity-backed patch antenna.
    Jeep Antenna Automobile antenna simulation with FDTD EM simulation technology.
    MRI RF Coil In this example, a birdcage-style MRI coil simulation is explained.
    Chaff RCS Modeling This example features an RCS analysis that includes a chaff cloud, generated using Python Scripting in EMPro.
    Test Fixture Contactor RF performance of a test board with a contactor is analyzed using FDTD simulation
    Log Periodic Dipole Array Antenna Simulation of LPDA Antenna using FDTD.
    Wireless Network Antenna Card An antenna card used for connecting a laptop PC to a wireless network is designed using FDTD simulation technology in EMPro. Includes measured and simulated results.
    HDMI Connector TDR simulations using FDTD technology are used to analyze a high-speed HDMI connector.
    Quasi-Yagi Antenna A planar X-band quasi-Yagi antenna is analyzed with the FEM simulator in EMPro.
    QFN Package In this example, a 3mm x 3mm 16-pin Quad Flat No-Lead (QFN) package is optimized to improve the frequency performance using the FEM Simulator.
    Wireless Power Transfer A proposed wireless power transfer system based on magnetic resonance is analyzed using 3D FEM simulation in EMPro, and compared to experimental results.
    High Power Magnetron The EMPro Eigenmode solver is used to analyze a high power Magnetron.
    Parameterized Design - Differential Lines This examples shows a typical parameterized differential microstrip transmission line design in EMPro.
    10GHz Waveguide Horn Antenna A microwave horn antenna at 10GHz was designed and simulated with finite difference time domain (FDTD) EM simulation technology.
    8x16 Patch Array Antenna An 8x16 Patch Array Antenna was designed and simulated using the FDTD Simulator in EMPro.
    EMI from Shielding Enclosures The effect of openings in a shielding enclosure are examined using FEM and FDTD simualtion in EMPro.

    Application Example Screenshot Summary
    LTCC RF Module An RF balun implemented in low temperature co-fired ceramic (LTCC) technology is simulated with 3D FEM technology in ADS.
    SIW Filter A Substrate Integrated Waveguide (SIW) bandpass filter is analyzed with the FEM simulator in ADS and EMPro.
    RF Filter with Shield The impact of a 3D shield on RF filter performance is characterized using FEM simulation in ADS.
    RCS and Scattering Simulation Radar Cross Section (RCS) and Scattering Simulation for F15 Fighter Jet with a plane wave excitation.
    Parameterized Design - DDRW A double ridge rectangular waveguide is parameterized in EMPro.
    Solder Bumps Solder bumps are simulated with 3D FEM in ADS utilizing the 3D EM Component capability.
    SATA Connector 3D simulations of a SATA connector is done using FDTD in EMPro, and then utilized in a signal integrity simulation in ADS.
    Defected Ground Structure DGS Two microstrip designs based on spiral defected ground structures (DGS) are simulated using FEM and FDTD technologies in EMPro, and results are compared to measurement data.
    VCO with Dielectric Resonator A 3D geometry model for a dielectric resonator is created in EMPro and then placed in a board layout and simulated with 3D FEM technology in ADS.
    SIW Cavity-Backed Antenna FEM simulation is used to analyze a SIW cavity-backed patch antenna.
    Jeep Antenna Automobile antenna simulation with FDTD EM simulation technology.
    MRI RF Coil In this example, a birdcage-style MRI coil simulation is explained.
    Chaff RCS Modeling This example features an RCS analysis that includes a chaff cloud, generated using Python Scripting in EMPro.
    Test Fixture Contactor RF performance of a test board with a contactor is analyzed using FDTD simulation
    Log Periodic Dipole Array Antenna Simulation of LPDA Antenna using FDTD.
    Wireless Network Antenna Card An antenna card used for connecting a laptop PC to a wireless network is designed using FDTD simulation technology in EMPro. Includes measured and simulated results.
    HDMI Connector TDR simulations using FDTD technology are used to analyze a high-speed HDMI connector.
    Multi-band Planar Array Antenna A multi-band (C- and X-band) planar array antenna is simultated with Momentum.
    Quasi-Yagi Antenna A planar X-band quasi-Yagi antenna is analyzed with the FEM simulator in EMPro.
    QFN Package In this example, a 3mm x 3mm 16-pin Quad Flat No-Lead (QFN) package is optimized to improve the frequency performance using the FEM Simulator.
    Wireless Power Transfer A proposed wireless power transfer system based on magnetic resonance is analyzed using 3D FEM simulation in EMPro, and compared to experimental results.
    High Power Magnetron The EMPro Eigenmode solver is used to analyze a high power Magnetron.
    Parameterized Design - Differential Lines This examples shows a typical parameterized differential microstrip transmission line design in EMPro.
    RF Module Fan-Out Wafer Level (FOWL) Packaging RF Module assembly and interconnect routing of multi-technology silicon RF transceiver and GaAs filter on a Fan-Out Wafer Level Package (FOWLP). Automatic RF net extraction with RFPro enables critical signal paths through 3D interconnects to be efficiently analyzed with EM-circuit cosimulation without layout modification.
    10GHz Waveguide Horn Antenna A microwave horn antenna at 10GHz was designed and simulated with finite difference time domain (FDTD) EM simulation technology.
    8x16 Patch Array Antenna An 8x16 Patch Array Antenna was designed and simulated using the FDTD Simulator in EMPro.
    BGA Package A 45 mm package with high speed traces is simulated with Momentum and compared against measured data.
    EMI from Shielding Enclosures The effect of openings in a shielding enclosure are examined using FEM and FDTD simualtion in EMPro.
    MMIC Power Amplifier The design of an MMIC Power Amplifier needs to consider the effects of inductor electromagnetic coupling on chip and the MMIC packaging off chip. RFPro makes it easy to perform EM-circuit co-simulation of the MMIC by automatically launching and combining the EM and circuit simulation  results to reveal the frequency shifts, gain and match degradation caused by EM couplings and MMIC packaging.